Overlapping people
Organisation 1: 3CEMS Corporation 三希科技有限公司
Organisation 2: Chipbond Technology Corporation
The following 1 people hold positions in both organisations on 2024-07-31:
| Name | Position in 3CEMS Corporation 三希科技有限公司 | Since | Position in Chipbond Technology Corporation | Since |
|---|---|---|---|---|
| Cheng, Joseph Wen Feng | NEDNon-Executive Director | DirDirector |
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